Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Copper:: 0.5OZ-10OZ
Application: Automotive, Industrial, Consumer Electronics
Wire: Oxygen Free Copper
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Material: FR4
Copper: 0.5OZ-10OZ
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Productname: Communication PCB Assembly
Viatype: Through Hole, Blind, Buried
Pcb Layers: 6 Layers
Impedance Control: Yes
Min Hole Diameter: 0.1mm
Viatype: Through Hole, Blind, Buried
Pcb Board: HDI PCB
Specification: PCB Customized Size
Application Field: 5G Communication
Board Thickness: 0.2-6mm
Surface Finishing: ENIG,HASL Lead Free
Customized: Yes
Board Thickness: 0.2-6mm
Outer Package: Carton
Surface Finishing: ENIG,HASL Lead Free
Communication Pcb: High Tg170 And High Tg180
Viatype: Through Hole, Blind, Buried
Application Field: 5G Communication
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