Layer: 1-22 Layers
Materials: CEM1, CEM3, FR-4, High Tg FR-4, Aluminum Board
Material: FR4
Copper: 0.5OZ-10OZ
Material: FR4
Copper: 0.5OZ-5OZ
Surface: HASL,ENIG,OSP,Hard Plating,Immersion Tin
Material: PI
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Copper: 0.5OZ-10OZ
Material: FR4
Copper: 0.5OZ-5OZ
Material: FR4
Copper: 0.5OZ-10OZ
Layer: 1-22 Layers
Materials: CEM1, CEM3, FR-4, High Tg FR-4, Aluminum Board
Material: FR4(Tg130-Tg180)
Hole Min.: 0.1mm
Material: FR4
LW/LS Min.: 0.05mm
Material: FR4
Layer: 4 Layers
Material: FR4
Copper: 3OZ
Material: FR4
Layer: 8 Layers
Material: FR4
Copper: 2OZ
Material: FR4
Layer: 8 Layers
Material: FR4
Copper: 0.5OZ-10OZ
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