Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Viatype: Through Hole, Blind, Buried
Application Field: 5G Communication
Surface Finishing: ENIG,HASL Lead Free
Communication Pcb: High Tg170 And High Tg180
Board Thickness: 0.2-6mm
Outer Package: Carton
Surface Finishing: ENIG,HASL Lead Free
Customized: Yes
Application Field: 5G Communication
Board Thickness: 0.2-6mm
Pcb Board: HDI PCB
Specification: PCB Customized Size
Min Hole Diameter: 0.1mm
Viatype: Through Hole, Blind, Buried
Pcb Layers: 6 Layers
Impedance Control: Yes
Productname: Communication PCB Assembly
Viatype: Through Hole, Blind, Buried
Solder Mask Color: Blue.green Ect
Pcb Quality System: ROHS
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Copper: 0.5OZ-10OZ
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Copper: 0.5OZ-10OZ
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
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