Communication PCB Assembly

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High Tg170 And High Tg180 Communication PCB Assembly HDI PCB Board Combined With Impedance Control For And Electronic Communication

Productname: Communication PCB Assembly

Viatype: Through Hole, Blind, Buried

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High Tg170 And High Tg180 Communication PCB Assembly Providing Solutions For Industrial Applications And Electronic Systems

Pcb Layers: 6 Layers

Impedance Control: Yes

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HDI PCB Communication PCB Assembly Including 6 Layers and HASL Lead Free Surface Finishing Tailored for Performance in Communication Networks

Min Hole Diameter: 0.1mm

Viatype: Through Hole, Blind, Buried

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HASL Lead Free Surface Finishing Surge Protection Equipment with Impedance Control Ensuring Durable and Electrical Surge Management

Pcb Board: HDI PCB

Specification: PCB Customized Size

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Min Hole Diameter 0.1mm Communication PCB Assembly Designed to Meet ROHS Standards and Board Thickness 0.2 to 6mm for Connectivity

Application Field: 5G Communication

Board Thickness: 0.2-6mm

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Impedance Control Thick Copper Pcb With ROHS Compliance Providing Electrical Properties And Enhanced Thermal Conductivity

Surface Finishing: ENIG,HASL Lead Free

Customized: Yes

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Min Hole Diameter 01mm Communication PCB Assembly 6 Layers High Tg170 and High Tg180 Optimized for Communication Devices

Board Thickness: 0.2-6mm

Outer Package: Carton

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Communication Pcb High Tg180 Heavy Current Customized Size Pcb Engineered for Electrical Power Management and Distribution

Surface Finishing: ENIG,HASL Lead Free

Communication Pcb: High Tg170 And High Tg180

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PCB Customized Size Communication PCB Assembly with ROHS System and HASL Lead Free Surface Finishing Delivering Communication Solutions

Viatype: Through Hole, Blind, Buried

Application Field: 5G Communication

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Blue Solder Mask Color Communication Infrastructure Modules with Outer Package Carton Ensuring Secure Transport and Data Flow

Solder Mask Color: Blue.green Ect

Pcb Quality System: ROHS

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