Min Component: 0201 / 01005
BGA Pitch: 0.35mm Fine Pitch
Max Layer Count: 32 Layers
Via Technology: Blind / Buried / Microvia
Frequency Range: Up To 77GHz
Base Material: Rogers / PTFE / FR4 High TG
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Certifications: ISO9001, ISO13485, IATF16949, UL E476377
Quality System: PDCA Continuous Improvement Management
Base Material: FR4 High TG (TG130-TG180)
Layer Count: 1-32 Layers
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Ass Size Man: 1200*400mm
Copper: 0.5~2OZ
Product Type: Electronics Manufacturing Services - Printed Circuit Board Assembly
Component Types: SMT, Through-hole, Mixed Technology
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