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EMS PCBA

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Turnkey PCB Assembly

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Quick Turn PCB Assembly

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Industrial PCB Assembly

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Power Protection PCB Assembly

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New Energy PCB Assembly

(98)

Communication PCB Assembly

(36)

Automotive PCB Assembly

(48)

Medical PCB Assembly

(46)

Flexible PCB Assembly

(30)

SMT PCB Assembly

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PCB Manufacturing

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Metal PCBs

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Cable Assembly

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Wire Harness

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Box Build Assembly

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HOT PRODUCTS

Soar New Energy PCB Manufacturing And Assembly Services PCBA

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0086-731-86963373

sales@suntekgroup.net

0086-731-84874736

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PCB assembly with conformal coating and Glue

Material: FR4,Rogers,Metal,Aluminum,CEM

Thickness: 0.3mm-2.5mm

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8 Layer PCB Assembly with IPC Class 2 Or 3 Quality and 0.10 Mm Minimum Hole Diameter

Quality Standard: IPC Class 2 Or 3

Line Width: >4mil,normal

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Multilayer High Tg FR4 PCB Assembly with Immersion Gold Surface Finish and Quick Turn Service

Test: AOI,ICT,100% Visual Inspection，FT

Material: FR-4

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Quick Turn PCB Assembly with FR-4 Material 4 Layer and 0.10mm Minimum Hole Diameter for Automotive Applications

Material: FR-4

Categary: Security PCB

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ISO13485 ISO9001 Certified 1L-32L Layers High-Density SMT PCB Assembly for Medical and Industrial Applications

Material:: FR4(Tg130-Tg180)/Rogers/Aluminum

Solder Mask:: Green,Blue,Black,Red,White,Matt Color

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ISO Certified Multilayer PCB Board Assembly Manufacturer with 0201 HDI PCB Assembly

Material:: FR4(Tg130-Tg180)/Rogers/Aluminum

Copper:: 0.5OZ-10OZ

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Multilayer Rigid / Rigid-flex / Flex PCB Assembly Manufacturer for Power Protection Board

Material:: FR4(Tg130-Tg180)/Rogers/Aluminum

Solder Mask:: Green,Blue,Black,Red,White,Matt Color

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PCB Customized Size Communication PCB Assembly with ROHS System and HASL Lead Free Surface Finishing Delivering Communication Solutions

Viatype: Through Hole, Blind, Buried

Application Field: 5G Communication

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Communication Pcb High Tg180 Heavy Current Customized Size Pcb Engineered for Electrical Power Management and Distribution

Surface Finishing: ENIG,HASL Lead Free

Communication Pcb: High Tg170 And High Tg180

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Min Hole Diameter 01mm Communication PCB Assembly 6 Layers High Tg170 and High Tg180 Optimized for Communication Devices

Board Thickness: 0.2-6mm

Outer Package: Carton

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Impedance Control Thick Copper Pcb With ROHS Compliance Providing Electrical Properties And Enhanced Thermal Conductivity

Surface Finishing: ENIG,HASL Lead Free

Customized: Yes

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Min Hole Diameter 0.1mm Communication PCB Assembly Designed to Meet ROHS Standards and Board Thickness 0.2 to 6mm for Connectivity

Application Field: 5G Communication

Board Thickness: 0.2-6mm

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HASL Lead Free Surface Finishing Surge Protection Equipment with Impedance Control Ensuring Durable and Electrical Surge Management

Pcb Board: HDI PCB

Specification: PCB Customized Size

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HDI PCB Communication PCB Assembly Including 6 Layers and HASL Lead Free Surface Finishing Tailored for Performance in Communication Networks

Min Hole Diameter: 0.1mm

Viatype: Through Hole, Blind, Buried

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High Tg170 And High Tg180 Communication PCB Assembly Providing Solutions For Industrial Applications And Electronic Systems

Pcb Layers: 6 Layers

Impedance Control: Yes

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High Tg170 And High Tg180 Communication PCB Assembly HDI PCB Board Combined With Impedance Control For And Electronic Communication

Productname: Communication PCB Assembly

Viatype: Through Hole, Blind, Buried

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