Copper: 0.5~2OZ
Soldering Method: Wave Soldering, Reflow Soldering, Hand Soldering
Max Board Size: 400mm * 1200mm
Max Layer: 38L
Component Types: SMT, Through-hole, Mixed Technology
Soldering Mask Color: Green
Certificates: ISO9001 IS13485 IATF16949 And UL
Soldering Mask Color: Green
Certifications: ISO9001, ISO13485, IATF16949, UL E476377
Quality System: PDCA Continuous Improvement Management
Quality System: PDCA Continuous Improvement Management
Assembly Type: SMT, THT/DIP, BGA, Mixed Technology
Inspection Coverage: 100% AOI, X-ray, ICT, Functional Testing
Board Size: Max 400mm X 1200mm
NPI Support: DFM Review, Engineering Validation, Pilot Run
Quality Standard: IPC-A-610 Class 2/Class 3
Component Sourcing: Full Turnkey, Partial Turnkey, Or Consigned
BOM Management: Full BOM Procurement And Cost Optimization
BOM Management: Full BOM Procurement And Cost Optimization
Quality Standard: IPC-A-610 Class 2/Class 3
Solder Type: Lead Or Lead-free (RoHS Compliant)
Inspection Standards: IPC-A-610 Class 2/Class 3
Certifications: ISO9001, ISO13485, IATF16949, UL E476377
Quality System: PDCA Continuous Improvement Management
IPC Standard: IPC-A-610 Class 2 And Class 3 Acceptable
Inspection Coverage: 100% AOI, X-ray, ICT, Functional Testing
Production Scale: 1 Pc Prototype To 50000+ Pcs Volume Production
NPI Support: DFM Review, Engineering Validation, Pilot Run
Features: 100% E-test
Guarantee: 1-year
Board Type: Rigid, Flexable, Rigid-flexable
Layercount: 2-16 Layers
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