Thickness: 4L
Material: FR4, PI
Thickness: 4L
Copper: 18um-45um
Surface: HASL,ENIG,OSP,Hard Plating,Immersion Tin
Material: PI
Application: Automotive, Industrial, Consumer Electronics
Wire: Oxygen Free Copper
Application: New Energy,Automotives,Industrial,Communication
Functional Testing: Yes
Surface: Lead Free HASL
Copper: 1oz Each Layer
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Copper:: 0.5OZ-10OZ
Solder Mask: Green
Surface: Lead Free HASL
Solder Mask: Green
Surface: Lead Free HASL
Material: FR4
Copper: 0.5OZ-10OZ
Layer: 6L
Copper: 1oz Each Layer
Surface: Lead Free HASL
Layer: 4L
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Copper: 0.5OZ-10OZ
Material: FR4
Copper: 0.5OZ-10OZ
Layer: 2L
Material: FR4 TG135
Send your inquiry directly to us