pcb manufacturing assembly (702) Online Manufacturer
Copper: 0.5--5OZ
Layer: Multilayer
Material: PI
Thickness: Rigid-Flex
Application Field: 5G Communication
Board Thickness: 0.2-6mm
Surface Finishing: ENIG,HASL Lead Free
Customized: Yes
Board Thickness: 0.2-6mm
Outer Package: Carton
Viatype: Through Hole, Blind, Buried
Application Field: 5G Communication
Layer: Double Side,Multilayer
Material: FR4(Tg130-Tg180)
Layer: 6layers
Material: FR4(Tg130)
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-3mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-3mm
Material: FR4
Copper: 0.5OZ-5OZ
Thickness: 4L
Material: FR4, PI
Thickness: Rigid-Flex
Material: FR4, PI
Copper: 18um-45um
LW/LS Min.: 0.05mm
Hole Min.: 0.1mm
LW/LS Min.: 0.05mm
Layers: 2-8
Material Precision: 0402+BGA0.5MM
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