pcb manufacturing and assembly (702) Online Manufacturer
Min Hole Diameter: 0.1mm
Viatype: Through Hole, Blind, Buried
Surface Finishing: ENIG,HASL Lead Free
Communication Pcb: High Tg170 And High Tg180
Viatype: Through Hole, Blind, Buried
Application Field: 5G Communication
Usage: OEM Electronics
Soldermaskcolor: Green, Red, Blue, Black, White, Yellow
Copper: 4OZ
Material: FR4, CEM-1, CEM-3
Silkscreen Color: White, Black, Yellow, Etc.
Copper: 4OZ
Base Material: FR4
Silkscreen Color: White, Black, Yellow, Etc.
Warranty: 1 Year
Max Thickness: T>4.5mm
Material: FR4
LW/LS Min.: 0.05mm
Material: FR4
LW/LS Min.: 0.05mm
Material: FR4
Copper: 0.5OZ-5OZ
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Material:: FR4(Tg130-Tg180)/Rogers/Aluminum
Solder Mask:: Green,Blue,Black,Red,White,Matt Color
Tolerance: ±0.1mm
Special Capability: Gold Finger Plating,Peelable,Carbon Ink
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