bga pcb assembly (160) Online Manufacturer
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Material:: FR-4, Aluminum, Copper, Gold
Copper:: 0.5OZ-10OZ
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Quality Standard: IPC Class 2 Or 3
Layers: 4 Layers
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(Tg130-Tg180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 3mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(TG130-T180),Rogers,Aluminum
Thickness: 1.6mm/2mm/4mm
Material: FR4(TG130-T180),Rogers,Aluminum
Thickness: 1.6mm/2mm/4mm
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Surface: HASL,ENIG,OSP,Hard Plating,Immersion Tin
Material: PI
Quality Standard: IPC Class 2 Or 3
Layers: 4 Layers
Surface: HASL,ENIG,OSP,Hard Plating,Immersion Tin
Material: PI
NPI Support: DFM Review, Engineering Validation, Pilot Run
Quality Standard: IPC-A-610 Class 2/Class 3
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