bga pcb assembly (160) Online Manufacturer
Surface: HASL,ENIG,OSP,Hard Plating,Immersion Tin
Material: PI
Material: FR4,Rogers,Metal,Aluminum,CEM
Thickness: 0.3mm-2.5mm
Material: RF4
Copper: 0.5--5OZ
Copper: 1OZ
Silkscreen Color: BLACK Solderingmask And White Silcscreeen
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Quality System: PDCA Continuous Improvement Management
Assembly Type: SMT, THT/DIP, BGA, Mixed Technology
Inspection Coverage: 100% AOI, X-ray, ICT, Functional Testing
Board Size: Max 400mm X 1200mm
Material: FR4(Tg130-Tg180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Material:: FR-4, Aluminum, Copper, Gold
Copper:: 0.5OZ-10OZ
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
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