bga pcb assembly (160) Online Manufacturer
Surface: HASL,ENIG,OSP,Hard Plating,Immersion Tin
Material: PI
Material: FR4,Rogers,Metal,Aluminum,CEM
Thickness: 0.3mm-2.5mm
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
Material: FR4,Rogers,Metal,Aluminum,CEM
Thickness: 0.3mm-2.5mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Quality System: PDCA Continuous Improvement Management
Assembly Type: SMT, THT/DIP, BGA, Mixed Technology
Inspection Coverage: 100% AOI, X-ray, ICT, Functional Testing
Board Size: Max 400mm X 1200mm
Material: FR4(Tg130-Tg180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 3mm
Surface Treatment: OSP: 0.5-0.5um
Item: PCBA For Electronic Project
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(TG130-T180),Rogers,Aluminum
Thickness: 1.6mm/2mm/4mm
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
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