bga pcb assembly (160) Online Manufacturer
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Material: FR4(Tg130-Tg180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
Silk: White
Inspection Standard: IPC Class II/ IPC Class III
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Material:: FR-4, Aluminum, Copper, Gold
Copper:: 0.5OZ-10OZ
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Material: FR4,Rogers,Metal,Aluminum,CEM
Thickness: 0.3mm-2.5mm
Quality Standard: IPC Class 2 Or 3
Layers: 4 Layers
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(Tg130-Tg180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 3mm
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