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Professional Communication Multi-Layer PCB Assembly with FR4 Material and 0.4mm-3mm Thicknes

Professional Communication Multi-Layer PCB Assembly with FR4 Material and 0.4mm-3mm Thicknes

Multi-Layer Communication PCB Assembly

FR4 Material Communication PCB Assembly

0.4mm-3mm Communication PCB Assembly

Place of Origin:

China or Cambodia

Brand Name:

Suntek Electronics Co., Ltd

Certification:

ISO9001 ISO13485 IATF16949 UL

Model Number:

2024-PCBA-112

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Request A Quote
Product Details
Layer:
4 Layers
Surface Finish:
Lead Free HASL
Impedance Control:
Yes
LW/LS Min.:
0.05mm
Material:
FR4
Warranty:
1 Year
Copper:
1OZ
Thickness:
0.4mm-3mm
X-RAY Inspection:
For BGA,OFN,QFP With Bottom Pads
Silkscreen Color:
White,black
Payment & Shipping Terms
Minimum Order Quantity
1pcs
Price
Customized products
Packaging Details
By ESD bags and carton
Delivery Time
5-7days after all components kitted
Payment Terms
TT,Paypal
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0086-731-84874736
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Product Description

Professional Communication PCB Assembly for Multi-Layer PCB Boards

 

Suntek Contract Factory:

Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC

assembly,Cable assembly,Mix technology assembly and Box-buildings.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.

 

Capabilities overview:

 

Layers: Rigid PCB 2 - 40 + Layers, Rigid-flex PCB 1 - 10Layers
Panel Size(max): 21" x 24"
PCB Thickness: 0.016" to 0.120"
Line & Spaces: 0.003" / 0.003" Inner Layers; 0.004" Outer Layers
Hole Size: 0.006" Thru Hole (Finished Size) and 0.004" Buried Via
Materials: FR4, High Tg, Rogers, Halogen-free material, Teflon, Polyimide
Surface Finishes: ENi/IAu, OSP, Lead-free HASL,Immersion Gold/Silver, Immersion Tin
Special Products: Blind/ Buried Via(HDI 2+N+2), Rigid Flex

 

PCB Requirements

Communication devices require PCBs to provide robust and reliable connectivity solutions for complex high speed components. Signal integrity needs to be maintained as signals travel between transceivers, antennas, power amplifiers and more. These requirements generally include:

  • High-Frequency Performance
    Many communication device signals operate at high frequencies in the microwave band. For example, smartphones incorporate multiband antennas that support 4G and 5G frequency bands – 700 MHz to 5 GHz for the latest generation. This requires PCB materials and construction to enable proper signal transmission without degradation through dielectric power loss or leaky RF conduction paths. We carefully select substrates and lamination materials tailored for high frequency operation based on dielectric constant, loss tangent, thermal conductivity, TCE and other parameters.
  • High Speed Signal Handling
    In addition to frequency, data rate throughput capacity is equally important. Cutting-edge phones with multi-Gbps Wi-Fi 6 speeds, high bandwidth wireless interfaces need PCBs with fine line traces and spaces (4-6 mil line/space is common for data lines). Short signal paths routed close together require low loss, tight impedance tolerance laminates as well as careful stackups for characteristic impedance control. And a robust power distribution network is key for clean power delivery to signal ICs and FPGAs operating at high clock rates. We design layer counts, trace dimensions, dielectrics and laminate materials specifically to maintain signal integrity in high speed signal paths.
  • EMI and Crosstalk Prevention
    With complex components in close proximity and interacting at high frequencies, communication PCBs must prevent unwanted coupling between traces. Short signal return paths, reference planes and proper component placement facilitate field confinement. Our engineers utilize careful stackup symmetry, selective isolation/shielding around sensitive components, ground stitching vias alongside traces, and special treatments to eliminate EMI emission and minimize crosstalk in dense layouts with high speed traces throughout multilayer boards.

Quality and Reliability

Delivering the highest reliability PCB solutions for mission-critical communication systems demands strict process and quality management upholding industry standards. As an ISO 9001 certified manufacturer, we’ve implemented robust infrastructure spanning materials qualification to volume fabrication monitoring:

  • IPC Standards
    We benchmark quality against IPC J-STD-001, IPC-A-600 and other widely adopted PCB quality specifications. Audits of our facilities verify standard classes conformance through acceptance testing of fabricated boards as well as process reviews targeting continual improvement per IPC guidelines. IPC certifications validate disciplined, optimized fabrication workflows.
  • Advanced Quality Planning
    Reliability risks are systematically identified during NPI through process controls selection, PFMEA/DRBFM and test vehicle measurements establishing performance baselines. We tailor process qualification, verification testing and QA sampling plans per customer requirements and design risk assessments. Each producible design has associated quality plan generating 1st pass yields.
  • Traceability
    Raw materials receipt to finished boards shipped are tracked by ERP software tools with batch/lot traceability. Barcode work orders follow boards through process documenting each fabrication, inspection and test operation in our secured database. Complete traceability with records retention delivers the transparency customers expect from their trusted PCB producers.

 

 

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