Material: FR-4, Aluminum, Copper, Gold
Maximum Board Thickness: 6.0mm
Material: FR-4, Aluminum, Copper, Gold
Type: Printed Circuit Board Assembly
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Layers: 2-20 Layers
Maximum Board Size: 600mm X 600mm
Minimum Trace/Space: 4mil/4mil
Testing: 100% Electrical Testing
Layer: 1-22 Layers
Materials: CEM1, CEM3, FR-4, High Tg FR-4, Aluminum Board
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Customization Options: Logo Printing, Color, Size, Material
Function: Enclosure For Electronic Components
MOQ: No Limited
Testing: AOI,ICT,100% Visual Inspection,FT
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
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