smt assembly service (160) Online Manufacturer
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-5mm
Material: FR4(TG130-TG180),Rogers,Aluminum,CEM
Thickness: 0.4mm-5mm
Min Component: 0201 / 01005
BGA Pitch: 0.35mm Fine Pitch
Base Material: FR4 High TG (TG130-TG180)
Layer Count: 1-32 Layers
Copper Weight: Up To 20oz
Layer Count: 1-32 Layers
Max Layer Count: 32 Layers
Via Technology: Blind / Buried / Microvia
Material: FR4
Thickness: 0.4mm-3mm
Test: AOI,ICT,100% Visual Inspection,FT
Material: FR-4
PCB Assembly: OEM
Thickness: 0.4mm-3mm
Assembly Details: SMT And Thru-hole, ISO SMT And DIP Lines
Board Type: Rigid, Flexable, Rigid-flexable
Layercount: 2-16 Layers
Board Type: Rigid, Flexable, Rigid-flexable
Max Board Size: 400mm * 1200mm
Product Type: Electronics Manufacturing Services - Printed Circuit Board Assembly
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Testing Methods: AOI, X-ray, ICT, Functional, High-voltage, Impedance
Solder Type: Lead Or Lead-free (RoHS Compliant)
Coating Type: Acrylic / Silicone / Polyurethane
Method: Spray / Dip / Brush
Max Board Size: 400mm * 1200mm
Max Layer: 38L
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