pcba printed circuit board assembly (310) Online Manufacturer
Layer: 4 Layers
Copper: 1OZ
Material: FR4 , PI
Copper: 35um
Min Hole Diameter: 0.1mm
Viatype: Through Hole, Blind, Buried
Application Field: 5G Communication
Board Thickness: 0.2-6mm
Layer: 4 Layers
Warranty: 1 Year
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Viatype: Through Hole, Blind, Buried
Application Field: 5G Communication
Copper: 1OZ
Impedance Control: Yes
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Type: Printed Circuit Board Assembly
Board Thickness: 0.2-6mm
Outer Package: Carton
Material: FR4
SMT: 0402 Pitch BGA X-RAY
Material: PI FR4
Impedance Control: Yes
Surface: Lead Free HASL
Layer: 4L
Material: FR4
Layer: 8 Layers
Layer: 6L
Copper: 1oz Each Layer
Send your inquiry directly to us