pcb box build assembly services (643) Online Manufacturer
Base Material: Fr4,Rogers,Getek,Halogen Free,Low Dk/Low Df
Build-up Material: RCC,FR4
Productname: Communication PCB Assembly
Viatype: Through Hole, Blind, Buried
Base Material: Fr4,Rogers,Getek,Halogen Free,Low Dk/Low Df
Build-up Material: RCC,FR4
Base Material: Fr4,Rogers,Getek,Halogen Free,Low Dk/Low Df
Build-up Material: RCC,FR4
Material: FR4
Thickness: 0.4mm-3mm
Layer: 4L
Material: FR4 TG170
Material: FR4
Copper: 2OZ
Material: FR4
Thickness: 0.4mm-3mm
Material: FR4
Thickness: 1.0mm
Copper: 0.5--5OZ
Material: FR4(Tg130)
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-3mm
Material: FR4
Thickness: 2L
Material: FR4
Thickness: 1.6mm
Material: FR4
LW/LS Min.: 0.05mm
Material: FR4
LW/LS Min.: 0.05mm
Material: FR4(Tg130-Tg180)
Thickness: 0.4mm-3mm
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