Place of Origin:
China/Cambodia
Brand Name:
Suntek
Certification:
ISO9001, ISO13485, IATF16949, UL
Model Number:
SUN-RF5G-8L
This 8-layer RF PCBA is engineered for 5G base station, small cell and microwave backhaul hardware. Rogers 4350B laminates keep insertion loss low across the 3.5GHz and 28GHz bands, while controlled impedance routing holds signal integrity from the radio front end to the antenna port.
| Item | Capability |
|---|---|
| Layer count | 8 layers, up to 32 layers |
| Base material | Rogers 4350B, high TG FR4, mixed stack-up |
| Impedance control | +/- 5%, TDR verified on every panel |
| Min trace / spacing | 0.2mm / 0.2mm |
| Surface finish | ENIG, immersion gold, HASL lead-free |
| Solder mask | Green, blue, black, matte black |
| Board size | Up to 1200mm x 400mm |
| Testing | AOI, X-Ray for BGA, TDR, RF functional test |
Assembled under IPC-A-610 Class 2 or Class 3, with IQC, IPQC, FQC and OQC gates. Facilities hold ISO9001, ISO13485, IATF16949 and UL certification, and both China and Cambodia production lines are available for tariff planning.
Send Gerber, BOM, pick-and-place file and stack-up requirements for a quote within 12 hours. Prototype orders start from one piece, and NDA can be signed before files are shared.
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