HDI Multilayer PCB Assembly 32 Layers Blind Buried Via China Factory Custom

HDI Multilayer PCB Assembly up to 32 Layers

Our HDI multilayer PCB assembly service supports complex stack-ups up to 32 layers using blind via, buried via and microvia technology. High density interconnect capability, fine line width and controlled impedance deliver reliable performance for advanced electronics that demand more routing density in less space.

Key Features

• Up to 32 layers multilayer HDI stack-up
• Blind via, buried via and microvia laser drilling
• Fine line width from 0.075mm and controlled impedance
• Multi-layer FR4 high TG base with ENIG surface finish
• 100% AOI and X-Ray inspection for high reliability

Suntek Group is a contract supplier in EMS field with one-stop solution for FCB/FPC assembly,Cable assembly,and Box-build assembly.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China; 

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.

With ISO9001:2015,ISO13485:2016,IATF 16949:2016 and UL E476377 certified,

We deliver qualified products with competitive price to clients all over the world.  

What Suntek Can Offer:

1. PCB and FPC bare board

2. PCB and FPC assembly

3. Components purchasing and matrials customization

4. One-stop of turnkey box build assembly 

5. Mixed technology mix assembly

6. Cable assembly and wire harness

7. Low/mid/high volume PCB assembly

8. BGA/QFN/DFN WITH X-ray insepction

9. IC programming/AOI/ICT/Functional test

Our certificates(ISO9001,ISO13485,ISO16949 and UL)