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PCB assembly for IoT industry monitoring building

PCB assembly for IoT industry monitoring building

IoT PCB assembly for monitoring

SMT PCB assembly for buildings

industrial monitoring PCB assembly

Place of Origin:

China/Cambodia

Brand Name:

Suntek/BECC

Certification:

ISO9001 ISO13485 IATF16949 UL

Model Number:

F016-041

Contact Us
Request A Quote
Product Details
Material:
FR4,Rogers,Metal,Aluminum,CEM
Thickness:
0.3mm-2.5mm
Layer:
1L-32L
Copper:
0.5-10OZ
Hole Min.:
0.1mm
Impedance Control:
Yes
Quality Standard:
IPC-610A Class 2 Or Class 3
Payment & Shipping Terms
Minimum Order Quantity
1
Price
Customized products
Packaging Details
By ESD bags and carton
Delivery Time
5-7days after all components kitted
Payment Terms
TT,Paypal
Product Description

PCBA/PCB EMS Turnkey PCB assembly SMT/THT/DIP assembly with 14-year experience

 

Suntek Group is a contract supplier in EMS field with one-stop solution for FCB/FPC assembly,Cable assembly,and Box-build assembly.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.

With ISO9001:2015,ISO13485:2016,IATF 16949:2016 and UL E476377 certified,

We deliver qualified products with competitive price to clients all over the world.

PCB assembly for IoT industry monitoring building 0 PCB assembly for IoT industry monitoring building 1

 

What Suntek Can Offer:

1. PCB and FPC bare board

2. PCB and FPC assembly

3. Components purchasing and matrials customization

4. One-stop of turnkey box build assembly 

5. Mixed technology mix assembly

6. Cable assembly and wire harness

7. Low/mid/high volume PCB assembly

8. BGA/QFN/DFN WITH X-ray insepction

9. IC programming/AOI/ICT/Functional test

 

A Contract Electronic Manufacturing Services Factory

Suntek Capability:

 

PCB Assembly(SMT) Product Capacity

SMT Capacity
SMT Item Capacity
PCB Max. size 400mm*1200mm(SMT)
Chip component 0201, 0402, 0603, 0805, 1206 package,BGA,QFN,DFN footprint
Min.pin space of IC 0.1mm
Min. space of BGA 0.2mm
DIP capacity 3 DIP assembly lines and 1 AI line
Assembly testing Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)

FCT(Functional Circuit Test)
Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.
 

PCBA Quality Control and Eqipments:

1) 100% AOI insepction

2) 100% ICT/FT test

3) 100% X-ray inspection for PCBAs with BGA,LGA,QFN,DFN...

4) 100% visual inpsection

PCB assembly for IoT industry monitoring building 2

 

PCB assembly for IoT industry monitoring building 3 

FAQ:

Q1.What is needed for quotation?

A: PCB : Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)

PCBA: PCB information, BOM, (Testing documents...)

Q2. What file formats do you accept for production?

A: Gerber file: CAM350, Protel 99SE, P-CAD 2001 PCB

BOM: Excel (PDF,word,txt)

Q3. Are my files safe?

A: Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process. NDA can be confirmed and signed at anytime.

Q4. MOQ?

A: There is no MOQ in Suntek. We are able to handle Small as well as large volume production with flexibility.

Q5.Shipping cost?

A: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.

Q6. Do you accept process materials supplied by clients?

A :Yes, we can provide all the components,or some components/all components consigned by customer is also acceptable.

 

Products` Photos:

PCB assembly for IoT industry monitoring building 4

PCB assembly for IoT industry monitoring building 5

 

 

 

 

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