Name: Multilayer High Tg FR4 PCB Assembly with Immersion Gold Surface Finish and Quick Turn Service
Brand: Suntek Electronics Co., Ltd.
SKU: F12365PCBA
Price: 50.00 USD
Availability: InStock

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Multilayer High Tg FR4 PCB Assembly with Immersion Gold Surface Finish and Quick Turn Service

Multilayer High Tg FR4 PCB Assembly

Immersion Gold Surface Finish PCBA

Quick Turn Service Printed Circuit Board Assembly

Place of Origin:

China/Cambodia

Brand Name:

Suntek

Certification:

ISO9001, ISO13485, TS16949 and UL E476377

Model Number:

F12365PCBA

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Product Details

Test:

AOI,ICT,100% Visual Inspection，FT

Material:

FR-4

Surface Technical:

OSP,ENIG,HASL

Line Width:

>4mil,normal

Smt Dip:

Support

Service:

One-stop Quick Turnkey Service

Minimum Hole Diameter:

0.10 Mm

Layer:

Payment & Shipping Terms

Minimum Order Quantity

5pcs

Price

USD+1-100+PCS

Packaging Details

Vacuum,Anti-static,ESD,Cartons

Delivery Time

3-6 weeks

Payment Terms

T/T,Paypal

Supply Ability

100pcs/hour

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Product Description

OEM Multilayer High Tg Immersion Gold FR4 PCBA Manufacturing

With over 10 years of manufacturing expertise in China and Cambodia, we provide comprehensive PCB assembly solutions. Our facilities feature advanced manufacturing equipment, professional engineering teams, dedicated purchasing and quality control departments, and well-trained operators to ensure consistently high-quality PCB assembly products.

SMT Assembly Parameters

Technology	PCB Type	Parameter	Assembly Side
SMT	PCB/Flex/Metal PCB/Rigid-Flex	Min Size: 10mm × 10mm	Single/Double
THT		Max Size: 410mm × 350mm
Punch		Thickness: 0.38mm ~ 6.00mm
In-circuit Test / Function Test		Min Chip: 0201
Glue, Burn-in, Conformal Coating		Fine-pitch: 0.20mm
BGA Re-work		BGA ball size: 0.28mm

Assembly Technology Capabilities

High Complexity Solutions

SMT + ICT + THT + Functional Testing
SMT + ICT + THT + Harness + Assembly + Functional Testing

Equipment Portfolio

SMT machines for printing, pick & place, reflow soldering
THT machines for wave soldering
Terminal machines
AOI (Automated Optical Inspection)
X-RAY inspection systems
Injection molding machines
AI (Automatic Inserting machines)

Medium Complexity Solutions

SMT + ICT
THT + Functional Testing
SMT + THT
THT + Harness + Functional Testing
Assembly + Functional Testing

Component Capabilities

General SMD + DIP components
DIP parts + Harness assemblies
SMD + DIP + Harness without injection molding
Components down to 0201 SMD size
BGA, LGA, FBGA, LCC + LGA packages
Harness + injection molding
Conformal coating applications

Basic Assembly Services

SMT-only assembly
THT-only assembly
Harness-only assembly
Assembly-only services
Material + Assembly turnkey solutions
Design + Material + Assembly complete services

Specialized Technical Services

IC Programming
BGA Rework
Chip on Board (COB)
Eutectic Soldering
Auto-Gluing
Conformal Coating

Assembly Process Flow

About Suntek Group

Suntek Group is a leading supplier in the EMS field, providing one-stop solutions for PCB/FPC assembly, cable assembly, mixed technology assembly, and box-build assemblies. Our manufacturing facilities include Suntek Electronics Co., Ltd in Hunan Province, China, and BLSuntek Electronics Co., Ltd in Kandal Province, Cambodia. We maintain ISO9001:2015, ISO13485:2016, IATF 16949:2016, and UL E476377 certifications, delivering qualified products with competitive pricing to clients worldwide.

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Multilayer High Tg FR4 PCB Assembly with Immersion Gold Surface Finish and Quick Turn Service

Multilayer High Tg FR4 PCB Assembly

Immersion Gold Surface Finish PCBA

Quick Turn Service Printed Circuit Board Assembly

Multilayer High Tg FR4 PCB Assembly with Immersion Gold Surface Finish and Quick Turn Service

Quick Turn PCB Assembly with FR-4 Material 4 Layer and 0.10mm Minimum Hole Diameter for Automotive Applications

Max Layer 6L PCB Manufacturing And Assembly Manufacturer in China/Cambodia

Quick Turn PCB Assembly Manufacturer in China and Cambodia with 0.10 Mm Minimum Hole Diameter 5 Layer Count ISO9001:2015 Certified

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