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Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection

Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection

bom pcb assembly

ball grid array assembly

New Energy pcb board assembly

Place of Origin:

China

Brand Name:

Suntek

Certification:

ISO9001, ISO13485, TS16949 and UL E476377

Model Number:

FPA8569-NE4

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Product Details
Minimum Hole Size:
0.2mm
Layers:
2-20 Layers
Maximum Copper Weight:
6oz
Application:
Electric Vehicles, Renewable Energy Systems, Energy Storage Systems
Lead Time:
3-5 Days After All Components Collected
Testing:
AOI,ICT,100% Visual Inspection,FT
Type:
Printed Circuit Board Assembly
Minimum Trace/Space:
4mil/4mil
Payment & Shipping Terms
Minimum Order Quantity
5pcs
Price
USD+1-100+PCS
Packaging Details
cartons and ESD bags
Delivery Time
3-6 weeks
Payment Terms
T/T,Paypal
Supply Ability
100pcs/hour
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Product Description

New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT

SMT Parameters:

Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection 0

Technology Involved:

Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection 1

 

Special Technology Involved

◆ IC Programming

◆ BGA rework

◆ Chip on Board/COB

◆ Eutectic soldering

◆ Auto-Gluing

◆ Conformal Coating

 

Assemly Flow Chart:

Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection 2

Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection 3

 

Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC assembly,Cable assembly,Mix technology assembly and Box-buildings.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.With ISO9001:2015,ISO13485:2016,IATF 16949:2016 and UL E476377 certified,.We deliver qualified products with competitive price to clients all over the world.


 

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