Name: THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA
Brand: Suntek Electronics Co., Ltd.
SKU: SRIF0326RI
Price: 50.00 USD
Availability: InStock

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THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA

flex pcb smt assembly

Imm Gold BGA PCBA

assembly smt

Place of Origin:

China/Cambodia

Brand Name:

Suntek

Certification:

ISO9001, ISO13485, TS16949 and UL E476377

Model Number:

SRIF0326RI

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THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA

Product Details

Material:

FR4 TG130 TG170 TG180

Color:

Red,Green,Black,Purple,White

Layer:

1-30L

Size:

100*200mm,1200*400mm,200*400mm

Surface Finishing:

Electroplate Ni/Au(Flash Gold/Soft Gold/Hard Gold), ENIG, HASL, Immersion Tin,OSP

Package:

0201 0603 0805 2410 BGA QFN DFN

Test:

AOI,ICT,100% Visual Inspection，FT

Blind Or Buried Vias:

Yes

Impedance Control:

Yes

Copper Thickness:

8 OZ

Payment & Shipping Terms

Minimum Order Quantity

5pcs

Price

USD+1-100+PCS

Packaging Details

60*40*30cm cartons and ESD bags

Delivery Time

1 week after all components collected

Payment Terms

T/T,Paypal

Supply Ability

100pcs/hour

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Product Description

OEM ODM PCB Assembly board High Efficiency Productivity Imm Gold With BGA

We have advanced manufacturing equipments,professional technology, professional engineer team,purchasing team,quality team and well trained operators to make sure the PCB assembly product with good&stable quality.

SMT Parameters:

Technology	Circuit	PCB/Flex/Metal PCB/Rigid-Flex	Parameter	Assembly Side	Single/Double
	Process	SMT		Min Size	10mm * 10mm
		THT		Max Size	410mm * 350mm
		Punch		Thickness	0.38mm ~ 6.00mm
		In-circuit Test Function Test		Min Chip	0201 chip
		Glue,Burn-in Conformal Coating		Fine-pitch	0.20mm
		BGA Re-work		BGA ball size	0.28mm

Technology Involved:

Item	Capability
Min.Finished Board Thickness	0.05mm
Max Board Size	500mm*1200mm
Min Laser Drilled Hole Size	0.025mm
Min Mechanical Drilled Hole Size	0.1mm
Min. Trace Width/Spacing	0.035mm/0.035mm
Min.Annular Ring of Single/Double-side Board	0.075mm
Min.Inner Layer Annular Ring of Multi-layer Board	0.1mm
Min.Outer Layer Annular Ring of Multi-layer Board	0.1mm
Min Coverlay Bridge	0.1mm
Min. Soldermask Opening	0.15mm
Min.Coverlay Opening	0.35mm*0.35mm
Min Single-ended Impedance Tolerance	+/-7%
Min Differential Impedance Tolerance
Max Layer Count	12L
Material Type	PI,Kapton
Material Brand	Shengyi,Taiflex,Thinflex,ITEQ,Allstar,Panasonic,Dupont,Jiujiang
Stiffener Material Type	FR4,PI,PET,Steel,AI,Adhesive Tape,Nylon
Coverlay Thickness	12.5um/25um/50um
Surface Finish	ENIG,ENEPIG,OSP,Gold Plating,Gold Plating+ENIG,Gold Plating+OSP,Imm Silver,Imm Tin,Plating Tin

Special Technology Involved:

◆ IC Programming

◆ BGA rework

◆ Chip on Board/COB

◆ Eutectic soldering

◆ Auto-Gluing

◆ Conformal Coating

THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA 0

Assemly Flow Chart:

Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC assembly,Cable assembly,Mix technology assembly and Box-buildings.
Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;
BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.With ISO9001:2015,ISO13485:2016,IATF 16949:2016 and UL E476377 certified,.We deliver qualified products with competitive price to clients all over the world.

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