PCB basic Materials and Structures

Base material:

1, FR-4: The most commonly used glass fiber reinforced epoxy resin laminate substrate. Good flame retardancy (FR=Flame Retardant).

2,Polyimide: Commonly used in flexible circuit boards or high-temperature applications, with good heat resistance.

3,CEM-1/CEM-3: Composite epoxy resin substrate (paper base/glass fiber cloth base), low cost, and inferior performance to FR-4.

4,Aluminum substrate: Metal-based circuit board with aluminum as the base layer, used for LED lights with high heat dissipation requirements, etc.

5,Copper substrate: Metal-based circuit board with copper as the base layer, excellent heat dissipation performance, used for high-power devices.

6,Ceramic substrate: Alumina, aluminum nitride, etc., used for extremely high frequency, high temperature or high reliability applications.

7,Copper clad laminate: A sheet with copper foil on one or both sides of an insulating substrate, which is the raw material for manufacturing PCBs.

Copper foil:

1,Electrolytic copper foil: Copper foil made by electrolytic deposition.

2,Rolled copper foil: Copper foil made by rolling process, with better ductility, often used in flexible boards.

3,Ounces: Common units of copper foil thickness, indicating weight per square foot of area (such as 1oz = 35μm).

Laminates:

1,Core board: The base material layer inside a multilayer board (usually FR-4 with copper cladding on both sides).

2,Prepreg: Glass fiber cloth impregnated with resin, not fully cured. It melts, flows and solidifies after being heated and pressed during the lamination process, bonding the layers together.

Conductive layer:

Conductive pattern formed by etching copper foil, including wires, pads, copper cladding areas, etc.

Insulating layer:

Insulating medium between the substrate and each layer (such as FR-4, prepreg, solder mask, etc.).

Welcome to contact with us www.suntekgroup.net