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iPad Third-Order HDI Board with 8OZ Max Copper Thickness and 0.4 16 Min Land mm

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August 14, 2024
Category Connection: PCB Manufacturing
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Tags:
#advanced pcb manufacturing #pcb manufacturing assembly #pcb manufacturing and assembly
Brief: Discover the high-quality iPad Third-Order HDI Board with 8OZ max copper thickness and 0.4 16 min land mm. Manufactured by Suntek Group, a leading PCB supplier with advanced capabilities, including 38L max layer speed and gold finger boards. Ideal for industrial control, auto, telecommunications, and more.
Related Product Features:
  • Supports rigid PCB up to 40 layers and rigid-flex PCB up to 10 layers.
  • Maximum panel size of 21" x 24" with PCB thickness ranging from 0.016" to 0.120".
  • Advanced line & spaces: 0.003" / 0.003" inner layers and 0.004" outer layers.
  • Precision hole size: 0.006" thru hole (finished size) and 0.004" buried via.
  • Uses high-quality materials like FR4, High Tg, Rogers, and halogen-free options.
  • Offers various surface finishes including ENi/IAu, OSP, and immersion gold/silver.
  • Specializes in blind/buried via (HDI 2+N+2) and rigid-flex PCBs.
  • ISO9001:2015, ISO13485:2016, IATF 16949:2016, and UL E476377 certified.
Faqs:
  • What files are required for PCB fabrication?
    We use Gerber files, BOM, and drawings for PCB fabrication.
  • How do you ensure the quality of your products?
    All products undergo 100% E-testing, with PCB assemblies checked via AOI, ICT, FT, visual inspection, and X-ray for BGA components.
  • What is the lead time for production?
    Samples take 3-5 working days, batch production 7-10 days, and PCB assembly 15-20 days, depending on files and quantity.
  • Can we visit your manufacturing facilities?
    Yes, you are welcome to visit our facilities in Xingsha Industrial Park, Changsha, Hunan province, China.
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